This record is sourced from an 8-K (Item 8.01) that NXP Semiconductors filed with the SEC on August 18, 2025, describing the underwriting agreement executed on August 12, 2025. At the time of filing the offering had been priced and was awaiting settlement, expected to complete on August 19, 2025, subject to customary closing conditions.
The underwriting agreement names Barclays Capital Inc. first among the five bank representatives of the underwriting syndicate: "Barclays Capital Inc., Goldman Sachs & Co. LLC, J.P. Morgan Securities LLC, PNC Capital Markets LLC and UBS Securities LLC, as representatives of the several underwriters named therein." Being listed first in an underwriting agreement typically signals a lead or left-lead role, though the filing does not use an explicit "lead" label for any single bank.
No legal advisors are disclosed in this 8-K.
On deal structure, the notes are senior unsecured obligations of the issuers, guaranteed by NXP Semiconductors N.V. on a senior unsecured basis, and were offered under an already-effective automatic shelf registration statement on Form S-3ASR. The company stated it intended to use net proceeds to redeem 500 million dollars of outstanding 5.350% senior unsecured notes due 2026 and 750 million dollars of outstanding 3.875% senior unsecured notes due 2026, with excess proceeds held temporarily in cash or short-term securities, or used for general corporate purposes including capital expenditures or short-term debt repayment.
Not disclosed in this exhibit: individual underwriting fees or gross spread, the specific allocation of notes among the five representative banks or the broader syndicate, and whether any single bank acted as sole or lead-left bookrunner as opposed to a joint representative role.